The dry film photoresist
Is the method of watering based on the pet with the subsequent lamination of a polyethylene film. Comes in rolls of a width of 300 mm long by 70 m.
The photoresist is Spectrum-PF, while retaining all the advantages of the known analogues, has a number of advantages that will allow you to obtain a vertical profile of the existence of almost any thickness of layers with a high resolution that is not dependent on the power of the UV source (the possibility of pattern formation with the size of 40 µm using UV lamps with a capacity > 250 watts).
The use of dry film photoresist will allow you to achieve high process stability process.
|Indicator name||The value|
|The thickness of the photosensitive layer, μm||25, 30, 40, 45, 50|
|The thickness of the base, µm||20|
|The thickness of the plastic film, µm||40|
|The effective exposure time from the source DRTG -3000 in the field of 320-420 nm, seconds||60 - 120|
|Resolution, µm||60 - 80|
|The resistance layer exposed in solutions with pH up to 10 at T=18-28°C, min.||1 and more|
The photoresist stands during the galvanic deposition of metals from the electrolyte with a pH of less than 7.
Recommendations for use:
The application of the photoresist is carried out on standard equipment laminating of various types, in accordance with the instructions for their use.
The exposure is conducted at facilities with a UV light source of any power. After exposure, the workplace can be kept for up to 30 minutes without compromising the quality of existence.
The manifestation is held in a 1-2% solution of soda ash at a temperature of 18-28°C, then rinsed with cold water, drying with compressed air and additional drying in an oven at a temperature of 70-80°C for 15-20 min.
The removal is performed in 5-20% aqueous solution of potassium hydroxide, sodium hydroxide or 3-5% aqueous solution of ammonia.